Responsibilities · Develop new processes for semiconductor fabrication · Design, collect data, analyze and compile reports on a variety of process engineering experiments · Perform hardware characterization and define process window and process-hardware interaction · Troubleshoot a variety of complex problems, perform root cause analysis and resolve a variety of difficult process engineering issues · Generate internal and external documentation for products, presentations and technical reports · Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision.
Requirements: · Minimum 2 years’ experience leading the development and deployment of thin film deposition processes by ALD, CVD or PEALD techniques. · Master’s Degree or PHD in Material Science, Physics, Chemical Engineering · Required Semiconductor Equipment Supplier experience and integrated process flow. · Strong knowledge of process development principles, design of experiments (DOE), and statistical process control. · Understanding of the interplay between equipment design and process performance in an HVM (High Volume Manufacturing) environment is a must for this position.
Preferred: · Ph.D degree · ALD, CVD or PEALD experience both in process and hardware · Thermal process experience · Fluency in speak and written English